Technology area
Design guide
Technology area
Design guide
TECHNOLOGY DRIVEN ELECTRONIC COMPANY
- Specifications of Manufacturing Process
Drill & Plating
Pattern & Coverlay
PSR & Marking Printing
Surface treatment & BBT
External Processing
Drill
| Category | Item | SPEC | Classification |
|---|---|---|---|
| Normal Drill | Min HoleØ | Min 0.1Ø , Max 6.0Ø | PTH |
| Min HoleØ | Min 0.15Ø | BVH (BURIED) | |
| Min HoleØ | Min 0.15Ø | PTH | |
| Min Via Land | Min 0.3Ø | ||
| Laser Drill | Min HoleØ | Min 0.05Ø | PTH |
| Max HoleØ | Max 0.15Ø | PTH | |
| Min Via Land | Min 0.25Ø | ||
| Common | Distance from hole to adjacent circuit | Min 0.2mm (on edge) | Instrument hole (NPTH) |
- There should be no drilling on the separation.
- Laser drill cannot work through more than 2 layers.
Cu Plating
| Category | Item | Specifications |
|---|---|---|
| Copper plate | D/S FPCB | 12 ㎛ ±3 ㎛ |
| Mulit FPCB | 15 ㎛ ±5 ㎛ | |
| Rigid - FLEX style : Rgid FPCB | 15 ㎛ ±5 ㎛ |
- Via hole Cu plate thickness.
- FCCL Cu plate thickness.
- Specifications for other thickness than the above-listed must be checked with related division.
Mongnae-ro 6, Danwon-gu, Ansan-si, Gyeonggi-do (Mongnae-dong, Lot # 32-1, Block 7, Banweol Industrial Complex) TEL. +82-31-491-6795 FAX. +82-31-491-6793
