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기술분야
디자인 가이드

기술분야

디자인 가이드

TECHNOLOGY DRIVEN ELECTRONIC COMPANY

Specifications of Manufacturing Process

Drill & Plating Pattern & Coverlay PSR & Marking Printing Surface treatment & BBT External Processing

Drill

TABLE
Category	Item	SPEC	Classification
Normal Drill	Min HoleØ	Min 0.1Ø , Max 6.0Ø	PTH
	Min HoleØ	Min 0.15Ø	BVH (BURIED)
	Min HoleØ	Min 0.15Ø	PTH
	Min Via Land	Min 0.3Ø
Laser Drill	Min HoleØ	Min 0.05Ø	PTH
	Max HoleØ	Max 0.15Ø	PTH
	Min Via Land	Min 0.25Ø
Common	Distance from hole to adjacent circuit	Min 0.2mm (on edge)	Instrument hole (NPTH)

There should be no drilling on the separation.
Laser drill cannot work through more than 2 layers.

Cu Plating

TABLE
Category	Item	Specifications
Copper plate	D/S FPCB	12 ㎛ ±3 ㎛
	Mulit FPCB	15 ㎛ ±5 ㎛
	Rigid - FLEX style : Rgid FPCB	15 ㎛ ±5 ㎛

Via hole Cu plate thickness.
FCCL Cu plate thickness.
Specifications for other thickness than the above-listed must be checked with related division.