디자인 가이드

기술분야
디자인 가이드

기술분야

디자인 가이드

TABLE
Category	Cu thickness	Specifications	Circuit allowance
S/S FPCB	1/3oz	Min 0.050 / 0.050mm	±20%
	1/2oz	Min 0.050 / 0.050mm	±20%
	1oz	Min 0.080 / 0.080mm	±20%
D/S FPCB	1/3oz	Min 0.065 / 0.065mm	±20%
	1/2oz	Min 0.070 / 0.070mm	±20%
	1oz	Min 0.10 / 0.10mm	±20%
Mulit FPCB	1/3oz	Min 0.70 / 0.70mm	±20%
	1/2oz	Min 0.85 / 0.85mm	±20%
	1oz	Min 0.10 / 0.10mm	±20%

Aperture size of maximum 0.001mm(1㎛) must not be used in designing.
All SMDs are to be designed using flash data (draw data must be avoided)
For any buried via hole, pattern width/interval must be min. 0.07mm.
Outer layer: outer circuit in a multi-FPCB product (e.g.,4-layer → 1L&4L are outer layers, 5-layer → 1L&5L are outer layers)
Inter layer: inner circuit in a multi-FPCB product (e.g.,4-layer → 3L&3L are outer layers, 5-layer → 2L,3L&4L are outer layers)

TABLE
Category	Specifics	Specifications
C/L fit-up	C/L open design specification	ⓐ=0.10mm
	C/L minimum interval	ⓑ=minimum 0.25mm
	C/L interval on land	ⓒ=minimum 0.10mm
	Distance to adjacent circuit	Min. 0.1mm (SMD to circuit)
C/L mold machining	Design specification for less than 1005 chip size	C/L entirely open
	Machinable distance	Min. 0.25mm
	Machined shape	Designed as square Folds can occur with ㄱ,ㄴ,ㄷ shapes
Fit-up	Fit-up allowance	0.1mm