Structure of FPCB

Technology area
Structure of FPCB

Technology area

Structure of FPCB

Rigid FPCB

Build up: Gloflex will become a company that continuously struggle and challenge toward the global best position with the core value and the core strategies.

Generic term of Via for build-up layer of build-up circuit board
Build-up method builds up conductor layers by forming a conductor layer after a insulation layer, one by one; It allows to build VIA layers needed for each layer, mostly layering on both sides of the board one by one; applied for high density, highly integrated devices as it allows high speed signaling
A specialized product applied for FPCB-Multi and RiGID-FPC products; allows to form more circuits than a same-sized product and realizes multi-function, high reliability and miniaturization

A specialized product applied for FPCB-Multi and RiGID-FPC products; allows to form more circuits than a same-sized product and realizes multi-function, high reliability and miniaturization
Applies mainly for connector cables and sub-boards; uses mainly supplementary boards for the soldering parts
Realizes high density FPCB
Compact design via a hidden VIA hole

TABLE
ITEM	SPEC
Layers	3~8
Base Material	Polyimide or Polyester
Cover-lay	Polyimide or Polyester or Solder Mask
Thickness	0.2mm~0.8mm
Line Width/Space	Normal Min, 0.07/0.07mm, Special Min. 0.06/0.06mm
Conductor	1/3oz, 1/2oz, 1oz, ED or RA Copper
Surface finish	Electroless nikel immersion Gold, Direct Gold,soft gold, Hard Gold
Stiffener	Polyimide, Glass epoxy, Steel use stainless
Double coated tape	Coated Tape 3M 467 , 966 ,Sony D3410 , T4100 etc
Min. through hole diameter	Bit Drill Via Normal Min. 0.02mm Special Min. 0.150mm
Hole diameter tolerance	10%
Solder resist	Photo Solder Resist, Polyimide flim