기술분야
FPCB 구조ITEM | SPEC |
---|---|
Bese Material | Polyimide or Polyester |
Cover-lay | Polyimide or Polyester or Solder Mask |
Thickness | 0.01mm ~ 0.3mm |
Line Width/Space | Nomal Min, 0.065/0.065mm, Special Min, 0.04/0.04mm |
Conductor | 1/3oz, 1/2oz, 1oz ED or RA Copper |
Surface finish | Electroless nikel immersion Gold, Direct Gold, soft Gold, Hard Gold, Sn plating |
Stiffener | Polyimide, Glass epoxy, Steel use stainless |
Double coated tape | Conted Tape 3M 467,966, Sony D3410, T4100 etc |